Alternative material: PPS

As an important stage in the semiconductor manufacturing process, Chemical Mechanical Polishing (CMP) requires strict process control, strict tolerances and high quality surface shape and surface. The miniaturization of products and electronic devices has further put forward higher requirements on process performance; all of these factors are becoming more and more demanding, and thus the performance requirements of the retaining ring assembly (a key component of the CMP process) are also getting higher and higher. CMP retaining ring is used to fix the wafer during the grinding process. It can produce lower polishing rate, smooth surface, strict plane tolerance, higher material stability and lower vibration, but the premise is that the material selection and design of CMP retaining ring should be reasonable. Especially the bottom surface of CMP retaining ring, if it is very flat, the output of wafer will also increase accordingly.

Main advantages:

1. High dimensional stability; can maintain modulus under high temperature conditions, improve higher process performance and product performance.

2. Easy to process;

3. Good mechanical properties; suitable for impact resistance, fast equipment assembly, robot speed and stable product quality.

4. Good chemical corrosion resistance; can withstand the corrosion of most chemicals, which is conducive to protecting parts and extending their service life.

5. Good wear resistance.

6. Can reduce the overall system cost, and the investment has been proven to be profitable.